Thermo-Mechanical Stress: Studying the combined effects of thermal and mechanical stresses on semiconductor devices, which is important for understanding failure mechanisms like delamination and cracking.

Electro-Thermal Analysis: Simulating the interaction between electrical currents and thermal effects in devices to optimize performance and reliability.

Wire Bonding and Flip Chip: Simulating the mechanical and thermal stresses in wire-bonded and flip-chip packages.