Key Capabilities of NTP Semiconductor’s
Testing and Quality Assurance Services
Wafer-Level Testing
Early-stage testing to identify potential issues before final packaging, reducing costs and improving yield.
Final (Post-Packaging) Testing
Comprehensive evaluations after packaging to confirm device reliability and performance.
Functional and Performance Testing
Assessing chips for functionality and performance to ensure they meet application-specific requirements.
Thermomechanical Testing
Testing under various thermal and mechanical conditions to verify durability and robustness.
Parametric and Electrical Testing
Detailed analysis of electrical parameters to ensure chips meet precise specifications.
NTP Semiconductor’s Testing and QA Services are a trusted choice for companies seeking to uphold the highest standards of semiconductor quality and reliability. With our extensive expertise and advanced testing methodologies, we help ensure that every product meets the demands of today’s competitive market, providing our clients with confidence and peace of mind in their semiconductor solutions.